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Titlebook: Variation Tolerant On-Chip Interconnects; Ethiopia Enideg Nigussie Book 2012 Springer Science+Business Media, LLC 2012 Analog Circuits and

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发表于 2025-3-21 19:04:01 | 显示全部楼层 |阅读模式
书目名称Variation Tolerant On-Chip Interconnects
编辑Ethiopia Enideg Nigussie
视频video
概述Provides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect.Describes design techniques to mitigate problems caused by variation.In
丛书名称Analog Circuits and Signal Processing
图书封面Titlebook: Variation Tolerant On-Chip Interconnects;  Ethiopia Enideg Nigussie Book 2012 Springer Science+Business Media, LLC 2012 Analog Circuits and
描述This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems.
出版日期Book 2012
关键词Analog Circuits and Signal Processing; Energy efficient interconnect; Interconnection networks; Low Pow
版次1
doihttps://doi.org/10.1007/978-1-4614-0131-5
isbn_softcover978-1-4899-9086-0
isbn_ebook978-1-4614-0131-5Series ISSN 1872-082X Series E-ISSN 2197-1854
issn_series 1872-082X
copyrightSpringer Science+Business Media, LLC 2012
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Ethiopia Enideg NigussieProvides comprehensive, circuit-level explanation of high-performance, energy-efficient, variation-tolerant on-chip interconnect.Describes design techniques to mitigate problems caused by variation.In
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https://doi.org/10.1007/978-1-4614-0131-5Analog Circuits and Signal Processing; Energy efficient interconnect; Interconnection networks; Low Pow
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978-1-4899-9086-0Springer Science+Business Media, LLC 2012
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Variation Tolerant On-Chip Interconnects978-1-4614-0131-5Series ISSN 1872-082X Series E-ISSN 2197-1854
发表于 2025-3-22 23:34:30 | 显示全部楼层
Introduction, also analog/mixed-signal blocks, MEMS based sensors, and other functional blocks are being integrated on the same die to build a complete system. However, the benefits of system integration are significantly reduced without efficient communication between these blocks. Thus, this book addresses the
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Enhancing Completion Detection Performance,since it was already demonstrated in Chap.4 that the current sensing interconnects achieve higher performance and better power efficiency than the interconnects using voltage-mode signaling with repeaters or pipelines.
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