Titlebook: VLSI-SoC: Design for Reliability, Security, and Low Power; 23rd IFIP WG 10.5/IE Youngsoo Shin,Chi Ying Tsui,Ricardo Reis Conference proceed

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1868-4238 International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology a

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Electromagnetic Transmission of Intellectual Property Data to Protect FPGA Designs,data is a serious challenge for the hardware security community. In this context, this chapter presents two ultra-lightweight transmitters using side channel leakage based on electromagnetic emanation to send embedded IP identity discreetly and quickly.

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Conference proceedings 2016he 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.

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A SAR Pipeline ADC Embedding Time Interleaved DAC Sharing for Ultra-low Power Camera Front Ends,ving 4X throughput as compared to traditional architectures. Simulations on a 130 nm foundry process shows that the proposed SAR Pipeline ADC draws 31 .W at 2 MS/s having a target Figure-of-Merit (FOM) of 87 fJ/conv. per step at Nyquist rate. The proposed compressive sensing front end achieves per patch energy per patch of 0.9 nJ.

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On the Use of System-on-Chip Technology in Next-Generation Instruments Avionics for Space Exploratiin a single silicon chip (e.g., microprocessor + programmable logic). This chapter discusses the implications of using this technology in deep-space exploration avionics, namely in the next generation of NASA science instruments that will be used to explore our Solar system. We present here our expe

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