Titlebook: VLSI Design and Test; 26th International S Ambika Prasad Shah,Sudeb Dasgupta,Jaynarayan Tudu Conference proceedings 2022 The Editor(s) (if

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1865-0929 ia, in July 2022..The 32 regular papers and 16 short papers presented in this volume were carefully reviewed and selected from 220 submissions. They were organized in topical sections as follows: Devices and Technology; Sensors; Analog/Mixed Signal; Digital Design; Emerging Technologies and Memory;

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Differential Multi-bit Through Glass Vias for Three-Dimensional Integrated Circuitsugh glass via (TGV) which comprises of vias filled with mixed carbon nanotube bundle (mCNTB) and separate metallic pads, the performance of differential multi-bit through glass vias (DM-TGCVs) is studied and analyzed. The effective complex conductivity of mCNTB is derived for computation of the high

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Design of a Low-Voltage Charge-Sensitive Preamplifier Interfaced with Piezoelectric Tactile Sensor fted by the sensor. The rapid scaling of MOSFETs in the modern era has made it quite difficult to design a charge-sensitive preamplifier that has high effective resistance, consumes low power, generates very little noise, and can operate at low frequencies. This work will target to design a charge se

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