Titlebook: Ultraclean Surface Processing of Silicon Wafers; Secrets of VLSI Manu Takeshi Hattori Book 1998 Springer-Verlag Berlin Heidelberg 1998 Tech

新义

Effects of Electrostatic Charge on Particle Adhesion on Wafer Surfacesthe deposition of airborne particles due to static electricity, device defects due to static discharge, electron beam exposure time, etc., constitute electron orbit damage. These types of electrostatic damage have manifested themselves at extremely high rates accompanying the higher integration of c

commonsense

Exposure

Analysis and Evaluation of Impurities on Wafer Surfacescon wafers. The impurities are classified as various kinds of organic and inorganic materials [1]. The analysis methods and the aim of the observation differ depending on the contamination and have a wide range of macroscopic or microscopic, chemical or physical techniques. Generally speaking, chemi

intellect

GEN

Electrical Evaluation of Metallic Impurities on Wafer Surfacesurface photovoltage (SPV) method, is it possible to determine the amount of charge due to heavy metals on the wafer surface. However, when a heat treatment is performed after contamination with heavy metals, the metals diffuse into the bulk, leading to a solid solution forming pairs with doped impur

Kidney-Failure

Book 1998e leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean hi

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Amorous

Ultraclean Technology for VLSI Manufacturing: An Overviewll-scale VLSI. The semiconductor contributes significantly not only to the electrical industry but to the development of manufacturing as a whole. It is even referred to as the “staple diet” of industry.

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