Titlebook: Springer Handbook of Semiconductor Devices; Massimo Rudan,Rossella Brunetti,Susanna Reggiani Book 2023 Springer Nature Switzerland AG 2023

工作

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Wet Chemical Processes for BEOL Technologyg (Sect. .), and chemical mechanical planarization (Sect. .). Each section details the introduction of the process and equipment used in 300-mm semiconductor industry from the beginning of Cu era. All the critical components of the process and equipment are described followed by the experimental res

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From FinFET to Nanosheets and Beyondd material innovation, since the 22 nm/14 nm node, new device architectures like FinFET have been introduced to tackle the increasing challenges related to power efficiency, performance, area scaling, and cost. With the introduction of FinFET, design-technology co-optimization also gained a lot of i

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Advanced Technologies for Future Materials and Devicese variability, and reliability. In this respect, novel materials and innovative device architectures are necessary for nanoscale FETs..This chapter presents a number of promising solutions for the “end of the roadmap,” with multi-gate devices, nanowires, tunnel transistors, ferroelectric FET, and hy