Titlebook: Solder Paste in Electronics Packaging; Technology and Appli Jennie S. Hwang Book 1989 Van Nostrand Reinhold 1989 assembly.coating.electroni

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Chemical and Physical CharacteristicsRegarding chemical and physical characteristics of solder paste, the coverage in certain areas is inevitably discussed in general terms in order to avoid proprietary information.

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Federal Specification QQ-S-571E and Amendment 4This specification was approved by the Commissioner, Federal Supply Service. General Services Administration, for the use of all Federal agencies.

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technology as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher

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Book 1989 as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count

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Rheology of Solder Pastesa given deformation or flow in a material under a set of specified conditions. It is broad in scope in its own field. This chapter is only intended to cover selected areas which are directly related to solder paste materials in terms of phenomena, characterization, practical measurements, and applic

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Application Techniquesowed with characteristics that can be readily adapted to automation. The types of application methods include mesh screen printing, metal mask stencil printing, pneumatic dot and line dispensing, positive displacement dispensing, and pin transfer.