| 书目名称 | Solder Joint Reliability Prediction for Multiple Environments |
| 编辑 | Andrew E. Perkins,Suresh K. Sitaraman |
| 视频video | http://file.papertrans.cn/872/871494/871494.mp4 |
| 概述 | Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability.Develops useful and easy-to-use tools for predicting solder j |
| 图书封面 |  |
| 描述 | .Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.. |
| 出版日期 | Book 2009 |
| 关键词 | array packages; development; electronic packages; finite element modeling; methodology; numerical simulat |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-0-387-79394-8 |
| isbn_softcover | 978-1-4419-4634-8 |
| isbn_ebook | 978-0-387-79394-8 |
| copyright | Springer-Verlag US 2009 |
|Archiver|手机版|小黑屋|
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