| 书目名称 | Reliability, Yield, and Stress Burn-In | | 副标题 | A Unified Approach f | | 编辑 | Way Kuo,Wei-Ting Kary Chien,Taeho Kim | | 视频video | | | 图书封面 |  | | 描述 | The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970‘s, one of the world‘s largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new | | 出版日期 | Book 1998 | | 关键词 | complexity; defects; design; development; electronics; manufacturing; microelectronics; modeling; production | | 版次 | 1 | | doi | https://doi.org/10.1007/978-1-4615-5671-8 | | isbn_softcover | 978-1-4613-7596-8 | | isbn_ebook | 978-1-4615-5671-8 | | copyright | Springer Science+Business Media New York 1998 |
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书目名称Reliability, Yield, and Stress Burn-In影响因子(影响力)
书目名称Reliability, Yield, and Stress Burn-In影响因子(影响力)学科排名
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