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Titlebook: Reliability Physics and Engineering; Time-To-Failure Mode J.W. McPherson Textbook 20101st edition Springer Science+Business Media, LLC 2010

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Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering,which might form. A molecular model is presented so that primary bond formation mechanisms (. and .) can be better understood. How these bonds form and respond to mechanical-stress/loading is very important for engineering applications. A discussion of elasticity, plasticity and bond breakage is pre
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J.W. McPhersonsion-induced motion of: a grain boundary, the surfaces of the two grains, and the triple junction where they all meet. One of the equations models diffusion along the moving grain boundary; another models the force balance which determines its speed. The remaining two equations model diffusion in th
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