找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Reliability Physics and Engineering; Time-To-Failure Mode J.W. McPherson Textbook 20101st edition Springer Science+Business Media, LLC 2010

[复制链接]
查看: 27604|回复: 52
发表于 2025-3-21 18:26:32 | 显示全部楼层 |阅读模式
书目名称Reliability Physics and Engineering
副标题Time-To-Failure Mode
编辑J.W. McPherson
视频video
概述Provides basic Reliability Physics and Engineering tools for Electrical Engineers, Mechanical Engineers, Materials Scientists, and Applied Physicists to build better products.Includes information for
图书封面Titlebook: Reliability Physics and Engineering; Time-To-Failure Mode J.W. McPherson Textbook 20101st edition Springer Science+Business Media, LLC 2010
描述All engineers could bene?t from at least one course in reliability physics and engineering. It is very likely that, starting with your very ?rst engineering po- tion, you will be asked — how long is your newly developed device expected to last? This text was designed to help you to answer this fundamentally important question. All materials and devices are expected to degrade with time, so it is very natural to ask — how long will the product last? The evidence for material/device degradation is apparently everywhere in nature. A fresh coating of paint on a house will eventually crack and peel. Doors in a new home can become stuck due to the shifting of the foundation. The new ?nish on an automobile will oxidize with time. The tight tolerances associated with ?nely meshed gears will deteriorate with time. Critical parameters associated with hi- precision semiconductor devices (threshold voltages, drive currents, interconnect resistances, capacitor leakages, etc.) will degrade with time. In order to und- stand the lifetime of the material/device, it is important to understand the reliability physics (kinetics) for each of the potential failure mechanisms and then be able to develop
出版日期Textbook 20101st edition
关键词Burnin and Defect Elimination; Failure Rate Reduction; Time-To; Time-To-Failure Modeling; design; develop
版次1
doihttps://doi.org/10.1007/978-1-4419-6348-2
isbn_ebook978-1-4419-6348-2
copyrightSpringer Science+Business Media, LLC 2010
The information of publication is updating

书目名称Reliability Physics and Engineering影响因子(影响力)




书目名称Reliability Physics and Engineering影响因子(影响力)学科排名




书目名称Reliability Physics and Engineering网络公开度




书目名称Reliability Physics and Engineering网络公开度学科排名




书目名称Reliability Physics and Engineering被引频次




书目名称Reliability Physics and Engineering被引频次学科排名




书目名称Reliability Physics and Engineering年度引用




书目名称Reliability Physics and Engineering年度引用学科排名




书目名称Reliability Physics and Engineering读者反馈




书目名称Reliability Physics and Engineering读者反馈学科排名




单选投票, 共有 1 人参与投票
 

1票 100.00%

Perfect with Aesthetics

 

0票 0.00%

Better Implies Difficulty

 

0票 0.00%

Good and Satisfactory

 

0票 0.00%

Adverse Performance

 

0票 0.00%

Disdainful Garbage

您所在的用户组没有投票权限
发表于 2025-3-21 23:11:57 | 显示全部楼层
发表于 2025-3-22 02:43:20 | 显示全部楼层
Increasing the Reliability of Device/Product Designs,Design engineers are continually asked reliability questions such as: (1) . Often the designer will attempt to answer these questions by stating a . which was used for a design
发表于 2025-3-22 07:23:51 | 显示全部楼层
J.W. McPhersonProvides basic Reliability Physics and Engineering tools for Electrical Engineers, Mechanical Engineers, Materials Scientists, and Applied Physicists to build better products.Includes information for
发表于 2025-3-22 11:44:27 | 显示全部楼层
发表于 2025-3-22 13:43:01 | 显示全部楼层
发表于 2025-3-22 19:20:57 | 显示全部楼层
Failure Rate Modeling, expected failure rate will be an important indicator of future warranty liability. For the customer, the expected failure rate will be an important indicator of future satisfaction. For . applications, it is of paramount importance for one to know that the expected failure rate will be extremely low.
发表于 2025-3-22 23:47:35 | 显示全部楼层
http://image.papertrans.cn/r/image/826363.jpg
发表于 2025-3-23 04:43:00 | 显示全部楼层
https://doi.org/10.1007/978-1-4419-6348-2Burnin and Defect Elimination; Failure Rate Reduction; Time-To; Time-To-Failure Modeling; design; develop
发表于 2025-3-23 05:41:02 | 显示全部楼层
J.W. McPhersonThe main result is that for small values of Ac, defined as the (experimentally controllable) jump in mole fraction of solute at the triple junction, the growth velocity of the trailing grain is approximately proportional to (Ac)., but for large positive Ac the velocity is approximately proportional
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-5-2 01:58
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表