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Titlebook: Reliability Physics and Engineering; Time-To-Failure Mode J. W. McPherson Textbook 2019Latest edition Springer Nature Switzerland AG 2019 D

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J. W. McPhersonth literary figures on a footing of equality, and the imperious self-assurance in the solitary heights of genius and absolute power; yielding to momentary impulses to the point of abandon, and heroic courage in the face of adversity which has parallels and examples only in the classic days of Rome.
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the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases..978-3-319-93683-3
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Time-to-Failure Models for Selected Failure Mechanisms in Integrated Circuits, addition, the use of dissimilar materials in a chip and in the assembly process produces a number of thermal expansion mismatches which can drive large thermomechanical stresses. These thermomechanical stresses can result in failure mechanisms such as stress migration (SM), creep, fatigue, cracking
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https://doi.org/10.1007/978-3-319-93683-3Device Reliability; Failure Modeling and statistics; Failure Rate Reduction; Maintenance and Reliabilit
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J. W. McPhersonProvides a comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications;.Explains the fundamentals of reliability physics and engineering tools for building bette
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Springer Nature Switzerland AG 2019
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