| 书目名称 | Recent Progress in Lead-Free Solder Technology | | 副标题 | Materials Developmen | | 编辑 | Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az | | 视频video | | | 概述 | Comprehensive overview of current developments in the emerging field of Pb-free solder technology.Examines various technologies involving rigid and flexible PCB.Touches upon a vast array of special to | | 丛书名称 | Topics in Mining, Metallurgy and Materials Engineering | | 图书封面 |  | | 描述 | This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder. | | 出版日期 | Book 2022 | | 关键词 | composite solder; intermetallic compound; electronic packaging; solder technology; laser soldering | | 版次 | 1 | | doi | https://doi.org/10.1007/978-3-030-93441-5 | | isbn_softcover | 978-3-030-93443-9 | | isbn_ebook | 978-3-030-93441-5Series ISSN 2364-3293 Series E-ISSN 2364-3307 | | issn_series | 2364-3293 | | copyright | The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl |
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发表于 2025-3-21 18:49:22
