Titlebook: Recent Progress in Lead-Free Solder Technology; Materials Developmen Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az Book 2022 The Edito

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Development of Geopolymer Ceramic-Reinforced Solder used in applications such as solid-state batteries and electrochemical sensors. The chapter encapsulates the properties of geopolymer ceramics as a reinforcement material in solder application. It also includes a discussion and examples of the geopolymer ceramic synthesis and fabrication. The advan

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The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimeion analysis. These two analyses successfully simulate the thermal distribution on the PCB package. The total deformation and equivalent stress of the PCB package were yet to be determined. It can be observed that the equivalent stress decreased when the isothermal ageing duration was getting longer

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Solder Paste’s Rheology Data for Stencil Printing Numerical Investigationsne plate design. The distance between two parallel plates can be manipulated accordingly which affects the usage of parallel plate design. Only the top spindle can be modified to adjust the angle of the top plate when using a cone plate design. The specific spindle type selected depends on the spind

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2364-3293 cs (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.978-3-030-93443-9978-3-030-93441-5Series ISSN 2364-3293 Series E-ISSN 2364-3307

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Leong Wai Keong,Ahmad Azmin Mohamad,Muhammad Firdaus Mohd Nazeri

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Mohd Sharizal Abdul Aziz,I. N. Sahrudin,M. S. Rusdi,M. H. H. Ishak,C. Y. Khor,Mohd Arif Anuar Mohd S