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Titlebook: Radio-Frequency Microelectronic Circuits for Telecommunication Applications; Yannis E. Papananos Book 1999 Springer-Verlag US 1999 CMOS.co

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发表于 2025-3-21 19:02:48 | 显示全部楼层 |阅读模式
书目名称Radio-Frequency Microelectronic Circuits for Telecommunication Applications
编辑Yannis E. Papananos
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图书封面Titlebook: Radio-Frequency Microelectronic Circuits for Telecommunication Applications;  Yannis E. Papananos Book 1999 Springer-Verlag US 1999 CMOS.co
描述.Radio-Frequency Microelectronic Circuits forTelecommunication Applications. covers the design issues ofradio-frequency microelectronic circuits for telecommunicationapplications with emphasis on devices and circuit-level design. Ituses a large number of real examples from industrial design as avehicle both to teach the principles and to ensure relevance startingfrom device level modeling to basic RF microelectronic circuit celldesign. Modeling for high-frequency operation of both active andpassive integrated devices is covered starting from the bipolartransistor to the MOS transistor to the modeling of integrated spiralinductors, resistors, capacitors, varactors and package parasiticsstructures. A chapter is also devoted to the presentation of the basicdefinitions and terminology used in RF IC design. The book continueswith the presentation of the principal building blocks of anintegrated RF front-end, namely, the LNA, the mixer, the VCO andintegrated filters. Design paradigms are provided classified on thetechnology used in each case: pure bipolar, CMOS, BiCMOS or SiGe...Radio-Frequency Microelectronic Circuits for TelecommunicationApplications. is essential reading for all resea
出版日期Book 1999
关键词CMOS; communication; electronic circuit; electronics; integrated circuit; modeling; transistor
版次1
doihttps://doi.org/10.1007/978-1-4757-3017-3
isbn_softcover978-1-4419-5104-5
isbn_ebook978-1-4757-3017-3
copyrightSpringer-Verlag US 1999
The information of publication is updating

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发表于 2025-3-21 23:52:03 | 显示全部楼层
Radio-Frequency Microelectronic Circuits for Telecommunication Applications978-1-4757-3017-3
发表于 2025-3-22 03:47:52 | 显示全部楼层
Integrated Passive Elements and Their Usage at High Frequencies,integrated inductors over silicon substrates, along with a CAD tool, have been presented [5,6]. This effort will significantly boost the usage of inductors in silicon integrated circuits, something that has been very common and for many years in . technologies.
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anintegrated RF front-end, namely, the LNA, the mixer, the VCO andintegrated filters. Design paradigms are provided classified on thetechnology used in each case: pure bipolar, CMOS, BiCMOS or SiGe...Radio-Frequency Microelectronic Circuits for TelecommunicationApplications. is essential reading for all resea978-1-4419-5104-5978-1-4757-3017-3
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Yannis E. Papananoshanging the states of PIN diode switches, an antenna can be made reconfigurable. The substrate used is FR4 having 1.6 mm thickness and a 4.4 dielectric constant. This antenna is analyzed using HFSS 15.0 simulation software. The proposed structure can produce all three reconfiguration properties.
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Yannis E. Papananos4 GHz, 9.6%) within 3rd IB. The simulated peak gain between 2.2 and 6.01dBi span throughout IBW region makes the dual CP bands appropriate for some part of S- and X-band, particularly fixed-satellite service (FSS) and synthetic aperture radar (SAR) applications.
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