| 书目名称 | Physical Design for Multichip Modules | | 编辑 | M. Sriram,S. M. Kang | | 视频video | | | 丛书名称 | The Springer International Series in Engineering and Computer Science | | 图书封面 |  | | 描述 | .Physical Design for Multichip Modules. collects togethera large body of important research work that has been conducted inrecent years in the area of Multichip Module (MCM) design. Thematerial consists of a survey of published results as well as originalwork by the authors. All major aspects of MCM physical design arediscussed, including interconnect analysis and modeling, systempartitioning and placement, and multilayer routing. For readersunfamiliar with MCMs, this book presents an overview of the differentMCM technologies available today. An in-depth discussion of variousrecent approaches to interconnect analysis are also presented.Remaining chapters discuss the problems of partitioning, placement,and multilayer routing, with an emphasis on timing performance. Forthe first time, data from a wide range of sources is integrated topresent a clear picture of a new, challenging and very importantresearch area. For students and researchers looking for interestingresearch topics, open problems and suggestions for further researchare clearly stated. .Points of interest include :. . Clear overview ofMCM technology and its relationship to physical design; ..Emphasis on performance-driven | | 出版日期 | Book 1994 | | 关键词 | algorithms; construction; interconnect; material; modeling | | 版次 | 1 | | doi | https://doi.org/10.1007/978-1-4615-2682-7 | | isbn_softcover | 978-1-4613-6153-4 | | isbn_ebook | 978-1-4615-2682-7Series ISSN 0893-3405 | | issn_series | 0893-3405 | | copyright | Springer Science+Business Media New York 1994 |
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发表于 2025-3-21 16:41:36
