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Titlebook: On-Chip Power Delivery and Management; Inna P. Vaisband,Renatas Jakushokas,Eby G. Friedma Book 2016Latest edition Springer International P

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发表于 2025-3-21 16:29:41 | 显示全部楼层 |阅读模式
书目名称On-Chip Power Delivery and Management
编辑Inna P. Vaisband,Renatas Jakushokas,Eby G. Friedma
视频video
概述Updates the vision of on-chip power delivery networks, traditionally viewed as a passive network.Describes power delivery and management systems and related design issues;.Includes both circuit models
图书封面Titlebook: On-Chip Power Delivery and Management;  Inna P. Vaisband,Renatas Jakushokas,Eby G. Friedma Book 2016Latest edition Springer International P
描述This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems.   Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
出版日期Book 2016Latest edition
关键词Circuits and Systems; Multi-layer Power Grid Networks; Nanoscale Integrated Circuits; On-Chip Decouplin
版次4
doihttps://doi.org/10.1007/978-3-319-29395-0
isbn_softcover978-3-319-80561-0
isbn_ebook978-3-319-29395-0
copyrightSpringer International Publishing Switzerland 2016
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发表于 2025-3-21 20:49:10 | 显示全部楼层
发表于 2025-3-22 03:22:21 | 显示全部楼层
tems and related design issues;.Includes both circuit modelsThis book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delive
发表于 2025-3-22 07:15:08 | 显示全部楼层
Decoupling Capacitancewer distribution network. Supplying high average currents and continuously increasing transient currents through the high impedance on-chip interconnects results in significant fluctuations of the power supply voltage in scaled CMOS technologies.
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发表于 2025-3-22 14:52:30 | 显示全部楼层
Efficient Placement of Distributed On-Chip Decoupling Capacitorscantly affects the design of the power/ground networks in high performance integrated circuits such as microprocessors. At higher frequencies, a distributed system of decoupling capacitors are placed on-chip to effectively manage the power supply noise [279].
发表于 2025-3-22 19:57:22 | 显示全部楼层
Inna P.-Vaisband,Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedmanangen, wie sie sich als soziale Konstruktionen der Wirklichkeit und Gegenentwurf zu vorherrschenden Deutungsangeboten der Massen in der Gesellschaft etablieren.978-3-658-35747-4978-3-658-35748-1Series ISSN 2625-3577 Series E-ISSN 2625-3615
发表于 2025-3-22 23:07:05 | 显示全部楼层
cing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.978-3-319-80561-0978-3-319-29395-0
发表于 2025-3-23 04:01:51 | 显示全部楼层
发表于 2025-3-23 08:37:11 | 显示全部楼层
Inna P.-Vaisband,Renatas Jakushokas,Mikhail Popovich,Andrey V. Mezhiba,Selçuk Köse,Eby G. Friedman
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