Titlebook: Nondestructive Characterization of Materials IV; Clayton O. Ruud,Jean F. Bussière,Robert E. Green Book 1991 Springer Science+Business Medi

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X-Ray Stress Studies of Aluminum Metallizations on Silicon Substrate Recently, stress induced voiding and notching of these films has become a serious reliability concern.. Moreover, since there is a steady trend towards larger packaging densities, the industry standard for the line width approaching now to the submicron scale, the failure risk of the interconnects,

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Micromechanical Analysis of the TiO2/Si Interface Using the Scanning Acoustic Microscopes. Of particular importance, in many cases, is the adhesion between substrate and film. Several methods are commonly used to test the mechanical behavior of these interfacial systems, but for the most part, they are not quantitative, lack repeatability, and result in destruction of the sample [1]. I

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The Historical Development of NDT of Woodrent controversy over the forest environment, it is easy to lose sight of the fact that the worldwide environment includes critical wood fiber usage for shelter, for communication media, and for hygienic products. Since its beginning, research on nondestructive testing of wood has had the goal of in

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