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Titlebook: Neural Networks; Proceedings of the S E. R. Caianiello (Professor) Conference proceedings 1968 Springer-Verlag Berlin · Heidelberg 1968 man

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P. I. M. Johannesmatechnology as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher
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J.-Cl. Levy as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count
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S. Noguchi,K. Nagasawa,J. Oizumi as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count
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B. Touschektechnology as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher
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