Titlebook: Nano-Bio- Electronic, Photonic and MEMS Packaging; C.P. Wong,Kyoung-Sik Moon,Yi (Grace) Li Book 20101st edition Springer-Verlag US 2010 Bi

饰带

On-Chip Thermal Management and Hot-Spot Remediation,ux and growing concern over the emergence of on-chip “hot spots.” The application of on-chip high heat flux cooling techniques provides a viable direction for the thermal management of such nanoelectronic components. Following a review of the relevant passive and active thermal management techniques

思考才皱眉

Some Aspects of Microchannel Heat Transfer,n and assembly methods have led to significant miniaturization of these systems. Miniaturized heat exchange devices have commonly utilized microchannel flow passages. This chapter reviews the fundamental flow and heat-transfer phenomena in microchannels, the most common numerical and experimental ch

Sedative

Pillory

Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips,d in academia and industries and has begun to make impact on medicine and biosciences. Packaging of these systems is an integral if not critical part of the device/system design and function. Because the applications and the designs of the chips are wide ranging, it is difficult to achieve a univers

整体

Packaging of Biomolecular and Chemical Microsensors,elected illustrative examples for chemical and biosensors for a range of applications. Approaches range from modified semiconductor device packages, fully customized packages to packages produced by rapid prototyping stereolithography. Packaging for room temperature operation of sensors, such as ion

Dorsal-Kyphosis

Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging,with electronic systems..Present the elements or building blocks of nanobioelectronic sensors, and fabrication methodologies..Describe functionality of nanobioelectronic sensors and nanopackaging.Identify the challenges in interface mechanisms between biosensor element and transducer; signal transdu

Criteria

Infant

Nanoscale Deformation and Strain Analysis by AFM/DIC Technique,o- and nanoscale components. The scanner drift of the atomic force microscope (AFM) is a great disadvantage to the application of digital image correlation to micro/nanoscale deformation measurements. This chapter has addressed the image distortion induced by the scanner drifts and developed a metho

阉割

Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials,T integration into circuits and packaging, with focus on CNT transfer technology, are presented. In comparison with CNT/polymer composites, nanographite/polymer composites are more promising for TIM applications, which is discussed together with current thermal measurement techniques, commercialized and non-commercialized.

全国性

http://image.papertrans.cn/n/image/660621.jpg