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Titlebook: Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration; J. Laconte,D. Flandre,J. -P. Raskin Book 2006 Springer-Verlag US 2006 CMOS.Co

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书目名称Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration
编辑J. Laconte,D. Flandre,J. -P. Raskin
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概述Co-integration of MEMS and MOS in SOI technology is promising and well demonstrated here.The impact of Micromachining on SOI devices is deeply analyzed for the first time.Include extensive TMAH etchin
图书封面Titlebook: Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration;  J. Laconte,D. Flandre,J. -P. Raskin Book 2006 Springer-Verlag US 2006 CMOS.Co
描述.Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost...Micromachined Thin-Film Sensors for SOI-CMOS Co-integration .covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology...We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 µm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution. The optimization of its selectivity towards aluminum is largely demonstrated...The second part focuses on sensors design and characteristics. A novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemen
出版日期Book 2006
关键词CMOS; Co-integration; Gas-flow sensors; REM; Silicon-on-Insulator; TMAH released membranes; Thin-films res
版次1
doihttps://doi.org/10.1007/0-387-28843-0
isbn_softcover978-1-4419-3957-9
isbn_ebook978-0-387-28843-7
copyrightSpringer-Verlag US 2006
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Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration978-0-387-28843-7
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standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemen978-1-4419-3957-9978-0-387-28843-7
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ten. Der Autor:innen-Kreis vertritt Mitgliedsstiftungen des Verbandes für gemeinnütziges Stiften, der Interessenvertretung gemeinnützig aktiver Stiftungen in Österreich: ERSTE Stiftung, HIL-Foundation, Julius Raab Stiftung, TU Wien Foundation. Insgesamt vereint der Verband 120 gemeinnützig aktive St
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silienz zu definieren. Auf dieser Basis schlagen wir in Teil drei vor, dass der normative Fokus von Resilienzförderung auf die Arbeitsbedingungen verschoben und damit die derzeit omnipräsente Überforderung des Individuums abgefedert wird. Dies zeigt, so unser Fazit, einen weiteren Forschungsbedarf i
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gen in einem ersten Schritt, wie diese sowohl für die technischen als auch die sozialen Aspekte eines regionalen Energiesystems in jeweils drei Indikatoren ausdifferenziert werden können. Als Diversitätsindikatoren werden Varietät, Balance und Disparität verwendet; als Konnektivitätsindikatoren die
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