Titlebook: Materials for High Temperature Engineering Applications; Geoffrey W. Meetham,Marcel H. Voorde Textbook 2000 Springer-Verlag Berlin Heidelb

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Geoffrey W. Meetham M.B.E.,Marcel H. Van de Voordemetrics.Detailed look at both macro- and micro-architectural[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] e

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Geoffrey W. Meetham M.B.E.,Marcel H. Van de Voordemetrics.Detailed look at both macro- and micro-architectural[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] e

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Geoffrey W. Meetham M.B.E.,Marcel H. Van de Voordemetrics.Detailed look at both macro- and micro-architectural[2]. The Cell Processor from Sony, Toshiba and IBM (STI) [3], and the Sun UltraSPARC T1 (formerly codenamed Niagara) [4] signal the growing popularity of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] e

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Geoffrey W. Meetham M.B.E.,Marcel H. Van de Voorde of such systems. Furthermore, Intel’s very recently announced 80-core TeraFLOP chip [5] exemplifies the irreversible march toward many-core systems with tens or even hundreds of processing elements. 1.2 The Dawn of the Communication-Centric Revolution The multi-core thrust has ushered the gradual d

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