Titlebook: Materials for Advanced Packaging; Daniel Lu,C.P. Wong Book 20091st edition Springer-Verlag US 2009 Compound.LED.Nanomaterial.development.e

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Thin Die Production,us applications leads to a lot of different solutions for making thin dies. This chapter describes recent developments on silicon wafer thinning and singulation. Various technologies for material removal and the associated damage caused by the material removal are reviewed in details. Different surf

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Advanced Substrates: A Materials and Processing Perspective,ates for flip chip BGA (FCBGA), tape substrate for tape BGA (TBGA), coreless substrate, and some specialty substrates such as substrates for RF modules, high performance substrates with low dielectric constant, and substrate with embedded components (active dies or passives). Future trend of organic

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Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips,olving packaging requirements including moisture sensitivity level (MSL), moldability, and environmental and other reliability 1000 requirements. This chapter provides an overview of most recent development on various aspects of EMCs including advanced material development, molding process, and appr

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Electrically Conductive Adhesives (ECAs),sotropic conductive adhesives/films (ACAs/ACFs) and their applications are reviewed first and then recent research achievements in material development and in both electrical and mechanical aspects of isotropic conductive adhesives (ICAs) including electrical conductivity improvement, contact resist

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Embedded Passives, new and unique solutions in IC and system integration, such as system-on-chip (SOC), system-in-package (SiP), system-on-package (SOP), have been hot topics recently. Despite the high level of integration, the number of discrete passive components (resistors, capacitors, or inductors) remains very h