| 书目名称 | Materials for Advanced Packaging | | 编辑 | Daniel Lu,C.P. Wong | | 视频video | | | 概述 | Provides a comprehensive summary of the most recent advances in materials development for advanced packaging.Covers emerging technologies such as digital health, bio-medical, and nano-materials / proc | | 图书封面 |  | | 描述 | .Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.. | | 出版日期 | Book 20091st edition | | 关键词 | Compound; LED; Nanomaterial; development; emerging technologies; interconnect; materials development; micro | | 版次 | 1 | | doi | https://doi.org/10.1007/978-0-387-78219-5 | | isbn_ebook | 978-0-387-78219-5 | | copyright | Springer-Verlag US 2009 |
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发表于 2025-3-21 16:23:54
