Titlebook: Materials and Processes for Surface and Interface Engineering; Yves Pauleau Book 1995 Springer Science+Business Media Dordrecht 1995 envir

BROOD

书目名称Materials and Processes for Surface and Interface Engineering影响因子(影响力)




书目名称Materials and Processes for Surface and Interface Engineering影响因子(影响力)学科排名




书目名称Materials and Processes for Surface and Interface Engineering网络公开度




书目名称Materials and Processes for Surface and Interface Engineering网络公开度学科排名




书目名称Materials and Processes for Surface and Interface Engineering被引频次




书目名称Materials and Processes for Surface and Interface Engineering被引频次学科排名




书目名称Materials and Processes for Surface and Interface Engineering年度引用




书目名称Materials and Processes for Surface and Interface Engineering年度引用学科排名




书目名称Materials and Processes for Surface and Interface Engineering读者反馈




书目名称Materials and Processes for Surface and Interface Engineering读者反馈学科排名

ear-canal

Terminal

Uses of Ion Implantation, hardness, wear, friction and chemical stability. There is a particularly extensive literature on the processing of semiconductor materials by ion implantation doping with electrically active ions. However in other areas, such as for changes in the optical properties in insulators, only a few research groups have made detailed studies.

禁止,切断

Custodian

SPER

Spectroscopic Analysis of Engineered Surfaces, Interfaces and Thin Layers,a of Materials Characterization [1], a book which appeared recently. The fundamentals of surface and thin layers analysis are well described in a book by Feldman and Mayer [2]. Necessarily, in this contribution only a modest selection of methods can be treated. A number of optical, electron and ion-beam spectroscopies will be discussed.

反复拉紧

curettage

TIA742

COUCH

Plasma and Discharge Physics for Materials Processing, thin film substrates. In addition, we will also discuss how this same plasma processing technology is finding use in novel applications such as implantation of large area structural elements [2], fabrication of ultra-pure, ultra-fine particles [3,4] and micro-machining of mechanical elements [5].