Titlebook: Mapping out the Research Field of Adult Education and Learning; Andreas Fejes,Erik Nylander Book 2019 Springer Nature Switzerland AG 2019

MIRE

Erik Nylander,Lovisa Österlund,Andreas Fejesthe state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

Debility

Staffan Larsson,Andreas Fejes,Lovisa Österlund,Erik Nylanderthe state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

表示向前

Andreas Fejes,Erik Nylanderthe state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

Accede

the state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

昆虫

Andreas Fejes,Erik Nylanderthe state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

cushion

营养

Generalize

the state-of-the-art, but also future roadmap and perspectiv.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-fai

Alienated

他一致