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Titlebook: Manufacturing Challenges in Electronic Packaging; Y. C. Lee,W. T. Chen Book 1998 Springer Science+Business Media Dordrecht 1998 assembly.c

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发表于 2025-3-21 16:08:01 | 显示全部楼层 |阅读模式
书目名称Manufacturing Challenges in Electronic Packaging
编辑Y. C. Lee,W. T. Chen
视频video
图书封面Titlebook: Manufacturing Challenges in Electronic Packaging;  Y. C. Lee,W. T. Chen Book 1998 Springer Science+Business Media Dordrecht 1998 assembly.c
描述About five to six years ago, the words ‘packaging and manufacturing‘ started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal­ lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based product
出版日期Book 1998
关键词assembly; circuit; control; design; electronics; fabrication; manufacturing; material; modeling; modelling; pa
版次1
doihttps://doi.org/10.1007/978-1-4615-5803-3
isbn_softcover978-1-4613-7659-0
isbn_ebook978-1-4615-5803-3
copyrightSpringer Science+Business Media Dordrecht 1998
The information of publication is updating

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Design for manufacture and assembly of electronic packages, different component technology such as chip-on-board (COB), very small peripheral arrays, chip scale packaging (CSP), μBGA’s and flip chip becoming mainstream (Tuck, 1995). Each advancement in technology brings new challenges to the manufacture and design of printed circuit boards. As a designer, o
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; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based product978-1-4613-7659-0978-1-4615-5803-3
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W. T. Chen,A. K. Trivedi,J. A. Welshounds and on their modes of action and specificity of binding with the receptors based on experimental and theoretical studies. These studies constitute a valuable asset for all those involved in drug development. .978-3-0348-0764-7978-3-0348-0364-9Series ISSN 1664-431X Series E-ISSN 2504-3692
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P. Conway,D. J. Williamsounds and on their modes of action and specificity of binding with the receptors based on experimental and theoretical studies. These studies constitute a valuable asset for all those involved in drug development. .978-3-0348-0764-7978-3-0348-0364-9Series ISSN 1664-431X Series E-ISSN 2504-3692
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S. A. Leclerc,G. Subbarayanounds and on their modes of action and specificity of binding with the receptors based on experimental and theoretical studies. These studies constitute a valuable asset for all those involved in drug development. .978-3-0348-0764-7978-3-0348-0364-9Series ISSN 1664-431X Series E-ISSN 2504-3692
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