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Titlebook: Managing Social Robotics and Socio-cultural Business Norms; Parallel Worlds of E Anshu Saxena Arora,Sabine Jentjens,Mohamad Sepehri Book 20

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书目名称Managing Social Robotics and Socio-cultural Business Norms
副标题Parallel Worlds of E
编辑Anshu Saxena Arora,Sabine Jentjens,Mohamad Sepehri
视频video
概述Examines the current state of the social robotics field.Investigates the impact of pandemic-driven technological change on the hybrid interactions in the new normal.Presents a comparison of AI and hum
丛书名称International Marketing and Management Research
图书封面Titlebook: Managing Social Robotics and Socio-cultural Business Norms; Parallel Worlds of E Anshu Saxena Arora,Sabine Jentjens,Mohamad Sepehri Book 20
描述.This book explores the co-existence of humans and AI in business contexts. Though AI and social robots have become ubiquitous, there are still many challenges facing technological expansion, including a true understanding of abstract concepts, transfer of knowledge to novel application problems, transparency and security guarantees, and distinguishing between random and logically meaningful relationships. While machines are valuable tools, only humans are capable of recognizing values which are the key to ethics and socio-cultural norms. Further, human virtues such as emotional intelligence, wisdom, and courage are required for decision making in many (private and professional) situations where machines would lead to sub-optimal and/or ethically questionable business outcomes..This book discusses how digital technology has emerged as a critical support system for organizations during the COVID-19 pandemic and how it can be used to complement human qualities that machines lack.It is divided into three sections that examine the complex world of AI and social robotics, digital technology and social media roles in business, and human actions that are embedded within socio-cultural bus
出版日期Book 2022
关键词AI; artificial intelligence; COVID-19; digital technology; cross-cultural negotiations; socio-cultural va
版次1
doihttps://doi.org/10.1007/978-3-031-04867-8
isbn_ebook978-3-031-04867-8Series ISSN 2662-8546 Series E-ISSN 2662-8554
issn_series 2662-8546
copyrightThe Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl
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Jaehwan Kim,Curley Ohio,Prim Patanachaisiri,Renata Buzolin,Carla Jamille Arapiraca,Anshu Saxena Arorlm materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry... ..The Engineering Materials and Processes. series focuses
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to the expected bulk value. Low EOT values around 0.75 nm have been obtained at very low leakage current of 4.5 × 10. A/cm. at 1 V in accumulation. The observed low frequency behaviour of the high frequency (. 1 kHz) C-V curves in inversion was attributed to the high intrinsic carrier concentration
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