找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Introduction to VLSI Process Engineering; The Society of Chemical Engineers of Japan Book 1993 Chapman & Hall 1993 manufacturing.process e

[复制链接]
查看: 49054|回复: 39
发表于 2025-3-21 19:56:09 | 显示全部楼层 |阅读模式
书目名称Introduction to VLSI Process Engineering
编辑The Society of Chemical Engineers of Japan
视频videohttp://file.papertrans.cn/475/474308/474308.mp4
图书封面Titlebook: Introduction to VLSI Process Engineering;  The Society of Chemical Engineers of Japan Book 1993 Chapman & Hall 1993 manufacturing.process e
描述Integrated circuits are finding ever wider applications througha range of industries. Introduction to VLSI Process Engineeringpresents the design principles for devices, describes the overallVLSI process, and deals with the essential manufacturing technologiesand inspection procedures.
出版日期Book 1993
关键词manufacturing; process engineering; semiconductor; semiconductor technology; silicon
版次1
doihttps://doi.org/10.1007/978-94-011-1562-9
isbn_softcover978-94-010-4682-4
isbn_ebook978-94-011-1562-9
copyrightChapman & Hall 1993
The information of publication is updating

书目名称Introduction to VLSI Process Engineering影响因子(影响力)




书目名称Introduction to VLSI Process Engineering影响因子(影响力)学科排名




书目名称Introduction to VLSI Process Engineering网络公开度




书目名称Introduction to VLSI Process Engineering网络公开度学科排名




书目名称Introduction to VLSI Process Engineering被引频次




书目名称Introduction to VLSI Process Engineering被引频次学科排名




书目名称Introduction to VLSI Process Engineering年度引用




书目名称Introduction to VLSI Process Engineering年度引用学科排名




书目名称Introduction to VLSI Process Engineering读者反馈




书目名称Introduction to VLSI Process Engineering读者反馈学科排名




单选投票, 共有 0 人参与投票
 

0票 0%

Perfect with Aesthetics

 

0票 0%

Better Implies Difficulty

 

0票 0%

Good and Satisfactory

 

0票 0%

Adverse Performance

 

0票 0%

Disdainful Garbage

您所在的用户组没有投票权限
发表于 2025-3-21 23:05:41 | 显示全部楼层
Packaging and process monitoring technology,ds of the chips and metal lead frames with fine wires. To prevent the chips from severe environments, they are covered with passivated materials. At this stage, it is possible to make the electrical connections to the printed circuit boards. The packaging technology necessary to seal Si devices is explained below.
发表于 2025-3-22 00:48:33 | 显示全部楼层
发表于 2025-3-22 06:03:56 | 显示全部楼层
发表于 2025-3-22 10:51:55 | 显示全部楼层
Process engineering aspects of VLSI production,In the preceding chapters, the history, unit processes and scope of VLSI technology have been described. Chapter 5 was devoted to a case study in order to bring out the details of the process technology. This chapter will focus on how chemical engineering can be applied to VLSI technology.
发表于 2025-3-22 14:44:56 | 显示全部楼层
发表于 2025-3-22 18:49:27 | 显示全部楼层
https://doi.org/10.1007/978-94-011-1562-9manufacturing; process engineering; semiconductor; semiconductor technology; silicon
发表于 2025-3-22 22:53:44 | 显示全部楼层
发表于 2025-3-23 04:03:57 | 显示全部楼层
发表于 2025-3-23 08:29:18 | 显示全部楼层
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 吾爱论文网 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
QQ|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-8-17 11:59
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表