Titlebook: Interfacial Compatibility in Microelectronics; Moving Away from the Tomi Laurila,Vesa Vuorinen,Jorma Kivilahti Book 2012 Springer-Verlag Lo

极大痛苦

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Interfacial Adhesion in Polymer Systems,vering such topics as adsorption, surface free energy models, and the kinetics of wetting. These concepts are then related to typical adhesion mechanisms acting across various interfaces found in microsystems. Attention is also given to processing, testing of adhesion, inspection of interfaces and e

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Evolution of Different Types of Interfacial Structures, large amount of examples concerning interfacial compatibility problems from the various fields of microtechnologies. The chapter is divided to sections based on the types of material interfaces considered. Thus, first metal–metal, then metal–ceramic and finally metal–polymer examples are discussed.

强行引入

https://doi.org/10.1007/978-1-4471-2470-2Chemical thermodynamics; Design for reliability; Materials compatibility; Microsystem packaging

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Materials and Interfaces in Microsystems, placed on the miniaturised heterogeneous structures of microsystems, which are composed of different types of materials in contact with each other. The interfacial reactions between the materials and their environment are examined from manufacturability, functionality and reliability points of view.

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消息灵通

978-1-4471-6068-7Springer-Verlag London 2012

fledged

MURAL

Tomi Laurila,Vesa Vuorinen,Jorma KivilahtiProvides solutions to several common reliability issues in microsystem packaging.Teaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materials.Comb

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Microsystemshttp://image.papertrans.cn/i/image/470948.jpg