Titlebook: Interconnect Technology and Design for Gigascale Integration; Jeff Davis,James D. Meindl Book 2003 Springer Science+Business Media New Yor

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S. J. Souri,T. Chiang,P. Kapur,K. Banerjee,K. C. Saraswat die Konzeptualisierung des Dings in Richtung Materialität, gegen dessen Zeichencharakter lenkten. Der zeitgenössische traditionelle Film unterwarf das authentische Material den erprobten erzählerischen Klischees. Den Ausweg aus dieser ästhetischen Sackgasse entdeckte der LEF-Theoretiker Sergej Tret

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新星

die Konzeptualisierung des Dings in Richtung Materialität, gegen dessen Zeichencharakter lenkten. Der zeitgenössische traditionelle Film unterwarf das authentische Material den erprobten erzählerischen Klischees. Den Ausweg aus dieser ästhetischen Sackgasse entdeckte der LEF-Theoretiker Sergej Tret

judiciousness

CT-angiography

Interconnect Opportunities for Gigascale Integration (GSI),rgy dissipation relative to that of transistors. These increases result from relatively larger average interconnect lengths (measured in gate pitches) and larger die sizes for successive generations. Therefore, interconnects have become the primary limit on both the performance and the energy dissipation of GSI.

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AMOR

Chip-to-Module Interconnections,t (I/O) connections was small, the DC power was minimal, and packaging density of silicon on boards was sparse. This made cost, reliability, and yield the focus of the chip-to-module connection technology.

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Book 2003as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM‘s revolutionary copper process to an in depth exploration into interconnect-aware computer arch

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Interconnect-Centric Computer Architectures,s success. To lower cost for the mass consumer market, these systems require efficient system performance because of stringent resource limitations in portable environments. Processor architectures must provide high computation throughput while minimizing chip area and power.

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