书目名称 | Interconnect Technology and Design for Gigascale Integration | 编辑 | Jeff Davis,James D. Meindl | 视频video | | 概述 | Is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems.It spans | 图书封面 |  | 描述 | .Interconnect Technology and Design for Gigascale Integration. is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM‘s revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry‘s next substantial milestone - gigascale integration. | 出版日期 | Book 2003 | 关键词 | LSI; Transistor; architecture; complexity; computer-aided design (CAD); integrated circuit; modeling | 版次 | 1 | doi | https://doi.org/10.1007/978-1-4615-0461-0 | isbn_softcover | 978-1-4613-5088-0 | isbn_ebook | 978-1-4615-0461-0 | copyright | Springer Science+Business Media New York 2003 |
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