Titlebook: Interconnect Technologies for Integrated Circuits and Flexible Electronics; Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam Book 2024 T

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Explicit Power-Delay Models for On-Chip Copper and SWCNT Bundle Interconnects,n (FDTD) technique. Further, an explicit power estimation model for both on-chip conventional copper and futuristic single-wall carbon nanotube (SWCNT) bundle interconnects using FDTD technique is proposed. The model deals with the analysis of two signaling schemes, namely, voltage-mode signaling (V

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Modelling and Analysis of Copper and Carbon Nanotube VLSI Interconnects,notube (CNT) interconnects. The proposed model is formulated on the Gaver-Stehfest method, which provides a relation between the time domain function and linear combination of the transfer function values. The values of delay and overshoot in single Cu and CNT lines are estimated for different line

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,Through Silicon Vias for 3D Integration—A Mini Review,ther than its planar counterparts. This effective use of space and thus miniaturization has led to a holistic performance enhancement of the very large-scale integration (VLSI) systems. Vertical interconnects or through silicon vias (TSVs) are the foundation of 3D integration. The fabrication techno

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Emerging Interconnect Technologies for Integrated Circuits and Flexible Electronics,eed for advanced interconnect technologies in catering to faster data transfer, advanced image processing, and stronger computing power, emphasizing the significance of integrating various components into one device. The chapter also analyzes current trends in chip-packages, circuit boards, cables,

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Contact and Interconnect Considerations for Organic and Flexible Electronics,rature, low cost, and large-area processing along with multi-functional capabilities in devices. Moreover, this technology has shown other important advantages over conventional electronics such as possibility of fabrication with natural materials and biodegradable substrates leading a path toward e

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