书目名称 | Interconnect Technologies for Integrated Circuits and Flexible Electronics |
编辑 | Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam |
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概述 | Focuses on the investigation of advanced on-chip interconnects to match the current and future technology requirements.Enriches understanding by including contributions from leading experts across the |
丛书名称 | Springer Tracts in Electrical and Electronics Engineering |
图书封面 |  |
描述 | .This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.. |
出版日期 | Book 2024 |
关键词 | Interconnects; Graphene Nanoribbon; Carbon Nanotube; Integrated Circuits; Signal Integrity; Modelling; FDT |
版次 | 1 |
doi | https://doi.org/10.1007/978-981-99-4476-7 |
isbn_softcover | 978-981-99-4478-1 |
isbn_ebook | 978-981-99-4476-7Series ISSN 2731-4200 Series E-ISSN 2731-4219 |
issn_series | 2731-4200 |
copyright | The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor |