Titlebook: IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials; Proceedings of the I Y. L. Bai,Q. S. Zheng,Y. G. Wei

LEVEE

书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials影响因子(影响力)




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials影响因子(影响力)学科排名




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials网络公开度




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials网络公开度学科排名




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials被引频次




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials被引频次学科排名




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials年度引用




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials年度引用学科排名




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials读者反馈




书目名称IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of NanostructuredMaterials读者反馈学科排名

ROOF

Micromechanics of Nanocomposites with Interface Energy Effectticle-filled nanocomposite are obtained. It is shown that the liquid-like interface tension influences the effective properties of the nanocomposite. Thus some misunderstandings of the interface energy effect in the existing literature are clarified.

Water-Brash

ONYM

Micro-Cantilevers for Thin Films: Young’s Modulus on a silicon substrate under different conditions. Finite element analysis is used to assess the influence of factors affecting the bending of thin films, and thus guide the analysis of micro-cantilever deflection data for reliable characterisation of the material.

Provenance

Shape Memory Effect and Pseudoelasticity in Cu Nanowiresernal stresses due to high surface-to-volume ratios at the nanoscale. The temperature-dependence of this behavior leads to a shape memory effect (SME). This behavior is well-defined for wires between 1.76 and 3.39 nm in size over the temperature range of 100–900 K.

CRANK

Dislocation-Assisted Grain Growth in Nanocrystalline Copper under Large Deformationf partial dislocations that dominate the deformation process do not lead to texture formation. The grain size distribution becomes extremely inhomogeneous. By observing the structural evolution, we demonstrate that partial dislocations assisted the grain growth that destroys the texture.

SLAY

defenses

Urgency

Y. L. Bai,Q. S. Zheng,Y. G. WeiCan serve as a reference text.The only work in print on this particular subject

曲解

Solid Mechanics and Its Applicationshttp://image.papertrans.cn/i/image/460592.jpg