| 书目名称 | Force Sensors for Microelectronic Packaging Applications |
| 编辑 | Jürg Schwizer,Michael Mayer,Oliver Brand |
| 视频video | http://file.papertrans.cn/346/345258/345258.mp4 |
| 概述 | Useful technique for packaging process control and analysis.Includes supplementary material: |
| 丛书名称 | Microtechnology and MEMS |
| 图书封面 |  |
| 描述 | .Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.. |
| 出版日期 | Book 2005 |
| 关键词 | Flip-chip; Force sensor; Piezoresistivity; Process monitoring; Semiconductor; Sensor; Technologie; Wire bon |
| 版次 | 1 |
| doi | https://doi.org/10.1007/b138345 |
| isbn_softcover | 978-3-642-06063-2 |
| isbn_ebook | 978-3-540-26945-8Series ISSN 1615-8326 Series E-ISSN 2365-0680 |
| issn_series | 1615-8326 |
| copyright | Springer-Verlag Berlin Heidelberg 2005 |
|Archiver|手机版|小黑屋|
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