Titlebook: Electronics Production Defects and Analysis; Oommen Tharakan Kuttiyil Thomas,Padma Padmanabhan Book 2022 The Editor(s) (if applicable) an

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Defects Due to the Usage of Non-FFF Components,s can happen probably because of non-availability of equivalent devices and substituting with near equivalent ones which need not be form and fit although may be functionally equivalent. This results in issues such as failure to maintain adequate clearance between conductive elements, single point f

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Defects in CAD Layout,layout design will transpire as such in the fabrication of PCBs, resulting in their rejection on subsequent inspection and testing. Hence, extreme care shall be taken in the design of CAD layout to ensure that all requirements are captured and implemented, the rules adhered to and all the layers of

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Book 2022have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coatin

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Socio-Markers and Information Transmissiono addressed. The defects at each stage shall be captured then and there itself, so that it is not propagated to the next level of the fabrication process. This chapter gives a global view on the above aspects and the classification of the different elements and stages into the subsequent eight chapters.

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Calcium Regulation of Cytosolic Enzymesefect have been discussed. The defect due to presence of flux residues has also been touched upon. The methods for mitigation/elimination of these defects have also been explained. A total of 45 live cases under 22 groups is presented.

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