| 书目名称 | Electronics Production Defects and Analysis |
| 编辑 | Oommen Tharakan Kuttiyil Thomas,Padma Padmanabhan |
| 视频video | |
| 概述 | Captures defects encountered during various phases of fabrication of electronic packages.Includes over 229 live cases - well illustrated with photographs and their zoomed versions for easy understandi |
| 丛书名称 | Springer Tracts in Electrical and Electronics Engineering |
| 图书封面 |  |
| 描述 | .This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time a |
| 出版日期 | Book 2022 |
| 关键词 | High Reliability Electronics; Multiple Touch Up; Overcoat Peeled; Component Overhang; Barrel-Annular Rin |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-981-16-9824-8 |
| isbn_softcover | 978-981-16-9826-2 |
| isbn_ebook | 978-981-16-9824-8Series ISSN 2731-4200 Series E-ISSN 2731-4219 |
| issn_series | 2731-4200 |
| copyright | The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor |
发表于 2025-3-21 16:40:50
