Titlebook: Electronic Materials; From Silicon to Orga L. S. Miller,J. B. Mullin Book 1991 Springer Science+Business Media New York 1991 electronic mat

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Technologies for High-Speed Compound Semiconductor ICs,ors, capacitors, and resistors are used. It is only at frequencies in excess of 6–7 GHz that fully distributed circuits are small enough to enable utilization of this type of impedance matching. In digital circuits the challenge is in yield improvement, the close spacing of components and signal lines, and the level of integration.

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Structures of and Bonding in Electronic Materials,rnate in the structure so that each atom is coordinated tetrahedrally by four of the opposite type; this leads to the zinc blende structure type, which is normally observed provided that the bond type is predominantly covalent.

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Key Optoelectronic Devices,h (10.–10. Hz) of light are now being installed worldwide, the energy of light is being harnessed by fabricating solar cells, and the power of light is concentrated in lasers for use in cutting, welding, medicine, and a host of other applications. In addition light is used in a multitude of forms for display, indicator, and control purposes.

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Indigenous Youth in Brazilian Amazoniah (10.–10. Hz) of light are now being installed worldwide, the energy of light is being harnessed by fabricating solar cells, and the power of light is concentrated in lasers for use in cutting, welding, medicine, and a host of other applications. In addition light is used in a multitude of forms for display, indicator, and control purposes.