找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Electronic Equipment Packaging Technology; Gerald L. Ginsberg Book 1992 Springer Science+Business Media New York 1992 assembly.base.develo

[复制链接]
楼主: Addendum
发表于 2025-3-23 10:17:56 | 显示全部楼层
Marc N. Potenza,Mark D. Griffithsfast and furious. As a result, the electronic equipment design engineer has a virtual menu of architectural options, Figure 2.1, to satisfy his requirements. Thus, the options range from the use off-the-shelf standard functions to the development of integrated circuits (ICs) that are unique to their design requirements.[2,2]
发表于 2025-3-23 17:22:36 | 显示全部楼层
发表于 2025-3-23 20:40:53 | 显示全部楼层
https://doi.org/10.1007/978-88-470-1189-2rconnections. At the subassembly level, such equipment is typically designed around the use of a set of modular circuit component subassemblies for optimum end product development, fabrication, assembly, testing and maintenance purposes. [1]
发表于 2025-3-24 00:31:50 | 显示全部楼层
Integrated Circuits,fast and furious. As a result, the electronic equipment design engineer has a virtual menu of architectural options, Figure 2.1, to satisfy his requirements. Thus, the options range from the use off-the-shelf standard functions to the development of integrated circuits (ICs) that are unique to their design requirements.[2,2]
发表于 2025-3-24 03:18:49 | 显示全部楼层
Packaged Component Subassemblies,r, during the last several years there has been considerable activity in developing new integrated-circuit device packages and improving the density and performance of the enhanced printed wiring boards (i.e., packaging and interconnecting structures) that mount and interconnect them.
发表于 2025-3-24 07:27:51 | 显示全部楼层
Subassembly Interconnection Systems,rconnections. At the subassembly level, such equipment is typically designed around the use of a set of modular circuit component subassemblies for optimum end product development, fabrication, assembly, testing and maintenance purposes. [1]
发表于 2025-3-24 13:04:31 | 显示全部楼层
发表于 2025-3-24 16:23:31 | 显示全部楼层
发表于 2025-3-24 22:58:11 | 显示全部楼层
https://doi.org/10.1007/978-88-470-1460-2r, during the last several years there has been considerable activity in developing new integrated-circuit device packages and improving the density and performance of the enhanced printed wiring boards (i.e., packaging and interconnecting structures) that mount and interconnect them.
发表于 2025-3-25 02:29:52 | 显示全部楼层
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-6-5 23:02
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表