找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Electronic Equipment Packaging Technology; Gerald L. Ginsberg Book 1992 Springer Science+Business Media New York 1992 assembly.base.develo

[复制链接]
查看: 31101|回复: 46
发表于 2025-3-21 19:07:42 | 显示全部楼层 |阅读模式
书目名称Electronic Equipment Packaging Technology
编辑Gerald L. Ginsberg
视频video
图书封面Titlebook: Electronic Equipment Packaging Technology;  Gerald L. Ginsberg Book 1992 Springer Science+Business Media New York 1992 assembly.base.develo
描述The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter­ mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro­ vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even g
出版日期Book 1992
关键词assembly; base; development; electron; electronics; heat; structure
版次1
doihttps://doi.org/10.1007/978-1-4615-3542-3
isbn_softcover978-1-4613-6572-3
isbn_ebook978-1-4615-3542-3
copyrightSpringer Science+Business Media New York 1992
The information of publication is updating

书目名称Electronic Equipment Packaging Technology影响因子(影响力)




书目名称Electronic Equipment Packaging Technology影响因子(影响力)学科排名




书目名称Electronic Equipment Packaging Technology网络公开度




书目名称Electronic Equipment Packaging Technology网络公开度学科排名




书目名称Electronic Equipment Packaging Technology被引频次




书目名称Electronic Equipment Packaging Technology被引频次学科排名




书目名称Electronic Equipment Packaging Technology年度引用




书目名称Electronic Equipment Packaging Technology年度引用学科排名




书目名称Electronic Equipment Packaging Technology读者反馈




书目名称Electronic Equipment Packaging Technology读者反馈学科排名




单选投票, 共有 1 人参与投票
 

1票 100.00%

Perfect with Aesthetics

 

0票 0.00%

Better Implies Difficulty

 

0票 0.00%

Good and Satisfactory

 

0票 0.00%

Adverse Performance

 

0票 0.00%

Disdainful Garbage

您所在的用户组没有投票权限
发表于 2025-3-21 21:59:46 | 显示全部楼层
978-1-4613-6572-3Springer Science+Business Media New York 1992
发表于 2025-3-22 03:28:50 | 显示全部楼层
发表于 2025-3-22 04:35:32 | 显示全部楼层
发表于 2025-3-22 10:58:12 | 显示全部楼层
发表于 2025-3-22 12:56:20 | 显示全部楼层
发表于 2025-3-22 18:18:05 | 显示全部楼层
发表于 2025-3-23 00:14:23 | 显示全部楼层
发表于 2025-3-23 02:44:34 | 显示全部楼层
发表于 2025-3-23 07:44:29 | 显示全部楼层
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-6-5 22:44
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表