Titlebook: Electrical Atomic Force Microscopy for Nanoelectronics; Umberto Celano Book 2019 Springer Nature Switzerland AG 2019 Atomic Force Microsco

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Eckart Richter,Thomas Feyerabend’s modifications. In particular, for piezo and ferroelectricity properties, the AFM overcame the limitations of macroscopic techniques. This chapter covers all the aspects of piezo and ferroelectricity measurements performed with an AFM. The chapter is divided in three main parts, one for each avail

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https://doi.org/10.1007/978-3-8348-9348-2 surface of magnetic materials and devices, magnetic force microscopy. The behaviour of such magnetic samples is well-known to be controlled by the formation and reversal of magnetic domains, each of which has a uniform magnetic moment separated by a region with moment rotation, a magnetic domain wa

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https://doi.org/10.1007/978-3-8351-9128-0or next generation electronic applications. Despite recent progresses in large area synthesis of 2DMs, their electronic properties are still affected by nano- or micro-scale defects/inhomogeneities related to the specific growth process. Electrical scanning probe methods, such as conductive atomic f

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The Atomic Force Microscopy for Nanoelectronics,on sub-µm metal oxide field-effect transistors (MOSFET) was beginning. Apparently uncorrelated, these events have positively influenced one another. In fact, ultra-scaled semiconductor devices required nanometer control of the surface quality, and the newborn microscopy techniques provided unprecede

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Mapping Conductance and Carrier Distributions in Confined Three-Dimensional Transistor Structures, processes and how they affect the incorporation, diffusion and activation of dopants and hence the final device performance. Scanning spreading resistance microscopy (SSRM) has emerged as the most valuable technique for 2D and 3D carrier mapping in semiconductor device structures due to its excelle

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Scanning Capacitance Microscopy for Two-Dimensional Carrier Profiling of Semiconductor Devices,fects and yield detractors. This results in engineers utilizing the Failure Mode and Effects Analysis (FMEA) duplicate of integrated circuits. In failure analysis (FA) of integrated circuits, Scanning Capacitance Microscopy (SCM) has been used to identify failure mechanisms, such as regions of incor