Titlebook: Dry Etching Technology for Semiconductors; Kazuo Nojiri Book 2015 Springer International Publishing Switzerland 2015 3D Integrated Circuit

诽谤

Anna Budzanowska,Tomasz Pietrzykowskivery 3 years, and logic devices and flash memory products, with 32-nm-level minimum feature sizes, were in volume production as of 2011. Some 28-nm production devices are also available as of this writing.

死亡率

现代

FACT

APNEA

Postulate

https://doi.org/10.1007/978-3-030-36460-1ious issue at the 32-nm node and beyond. Furthermore, the discussion includes a review of the double-patterning technology, which is the hot topic of the moment, and three-dimensional integrated circuit (3D IC) etching for the 16-nm node and beyond.

压倒

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感染

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