Titlebook: Cleaning Printed Wiring Assemblies in Today’s Environment; Les Hymes Book 1991 Van Nostrand Reinhold 1991 communication.evaluation.informa

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https://doi.org/10.1007/978-94-011-6967-7communication; evaluation; information; material; media; technology; telecommunications; testing

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Book 1991environmental responsibilities. At the time ofthis writing, which has spanned the latter portion of 1989 and early 1990, the issue of choosing a new approach to producing PW As free of detrimental residues while using environmentally acceptable manufacturing techniques ap­ peared to be the major con

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Cleaning Printed Wiring Assemblies in Today’s Environment

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Design and Process Considerations,igns, assembly layout, and the soldering, fluxing, and cleaning processes. Selection of the cleaning agent and process is itself dependent on the chemistry of the total material system. This includes solder, flux, substrate, solder mask, component, and marking materials as well as miscellaneous proc

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