Titlebook: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics; G. Q. Zhang,L. J. Ernst,O. Saint Leger Book 2000 Springer Science+

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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics978-1-4757-3159-0

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Thermal and Mechanical Problems in Microelectronics,description of typical reliability concerns at component and PCB level is given and the effects of temperature on the reliability of microelectronics devices are outlined. The origin of thermomechanically induced stresses is explained and finally, future technology requirements facing the assembly a

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Solder Material Characterisation and Modelling,of reversible shear tests on flip chip solder joints under isothermal conditions. Two micro shear testers have been designed and built for this task. One tester is optimized to achieve high precision. The second tester works very similar but fits in a UHV chamber. This way, it enables in-situ SEM ob

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Generic Issues in Numerical Modelling,; appropriate simulation is a vital component of any ‘right first time’ philosophy. Many excellent numerical modelling packages exist which enable simulation of thermal and mechanical behaviour, but the usefulness of simulation results depends crucially on the users’ understanding of the problem to

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Simulation for fatigue, cracks and delamination,theoretical investigations of stresses within electronic material compounds induced by environmental conditions, especially temperature changes, require both the characterization of materials properties and materials interface properties. Measurement results on typical commercially available electro