Titlebook: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics; G. Q. Zhang,L. J. Ernst,O. Saint Leger Book 2000 Springer Science+

凹处

Infinite Group Actions on PolyhedraThis paper gives an overview of the current state of non-linear finite element computer programs in relation to the analysis of structures. In addition, it concentrates on two specific areas, namely the introduction of techniques for adaptive re-meshing and the simulation of the propagation of delamination.

与野兽博斗者

耕种

Perspectives of Non-Linear Simulation,This paper gives an overview of the current state of non-linear finite element computer programs in relation to the analysis of structures. In addition, it concentrates on two specific areas, namely the introduction of techniques for adaptive re-meshing and the simulation of the propagation of delamination.

航海太平洋

遗忘

, EuroSimE2000. For the first time, peoplefrom the electronics industry, research institutes, software companiesand universities joined together to discuss present and possiblefuture thermal and mechanical related problems and challenges inmicro-electronics; the state-of-the-art methodologies for th

OASIS

Between

Thermal and Mechanical Problems in Microelectronics,devices are outlined. The origin of thermomechanically induced stresses is explained and finally, future technology requirements facing the assembly and packaging community are described and possible solutions are introduced.

dominant

Indolent

Simulation-based optimization in virtual thermo-mechanical prototyping of electronic packages,in this paper shows that combining reliable nonlinear FEM-based simulation models with this optimization strategy is an effective and efficient method for virtual thermo-mechanical prototyping of electronic packages.

泄露