找回密码
 To register

QQ登录

只需一步,快速开始

扫一扫,访问微社区

Titlebook: Advanced Thermal Design of Electronic Equipment; Ralph Remsburg Book 1998 Chapman & Hall 1998 Phase.heat transfer.material.performance.rel

[复制链接]
查看: 17018|回复: 40
发表于 2025-3-21 17:38:02 | 显示全部楼层 |阅读模式
期刊全称Advanced Thermal Design of Electronic Equipment
影响因子2023Ralph Remsburg
视频video
图书封面Titlebook: Advanced Thermal Design of Electronic Equipment;  Ralph Remsburg Book 1998 Chapman & Hall 1998 Phase.heat transfer.material.performance.rel
影响因子The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther­ mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat­ ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliab
Pindex Book 1998
The information of publication is updating

书目名称Advanced Thermal Design of Electronic Equipment影响因子(影响力)




书目名称Advanced Thermal Design of Electronic Equipment影响因子(影响力)学科排名




书目名称Advanced Thermal Design of Electronic Equipment网络公开度




书目名称Advanced Thermal Design of Electronic Equipment网络公开度学科排名




书目名称Advanced Thermal Design of Electronic Equipment被引频次




书目名称Advanced Thermal Design of Electronic Equipment被引频次学科排名




书目名称Advanced Thermal Design of Electronic Equipment年度引用




书目名称Advanced Thermal Design of Electronic Equipment年度引用学科排名




书目名称Advanced Thermal Design of Electronic Equipment读者反馈




书目名称Advanced Thermal Design of Electronic Equipment读者反馈学科排名




单选投票, 共有 0 人参与投票
 

0票 0%

Perfect with Aesthetics

 

0票 0%

Better Implies Difficulty

 

0票 0%

Good and Satisfactory

 

0票 0%

Adverse Performance

 

0票 0%

Disdainful Garbage

您所在的用户组没有投票权限
发表于 2025-3-21 23:01:19 | 显示全部楼层
and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliab978-1-4613-4633-3978-1-4419-8509-5
发表于 2025-3-22 02:20:14 | 显示全部楼层
Front Matterl world in which ruminants forage for a living. I posit that the dispersion of food in the landscape is a species-specific construct with the result that the foodscape of two species foraging in the same landscape will differ because of their differing views of food and their differing ability to se
发表于 2025-3-22 07:29:40 | 显示全部楼层
发表于 2025-3-22 08:46:02 | 显示全部楼层
Radiation Heat Transfer in Electronic Equipment,..Resource Management for Distributed Multimedia Systems. is acomprehensive view of resource management for a broad technicalaudience that includes computer scientists and engineers involved indeveloping multimedia applications.978-1-4612-8613-4978-1-4613-1413-4
发表于 2025-3-22 15:00:51 | 显示全部楼层
Heat Transfer With Phase Change,ecent research has identified several factors responsible for the declining N content in lowland soils: nitrate accumulation in soils during the dry phase followed by its loss on reflooding, small amounts of crop residues returned to the soils, little use of organic manures and symbiotic N. fixing s
发表于 2025-3-22 17:37:44 | 显示全部楼层
Acoustics for Electronic Equipment,ased by 280% and 400% when WCD was pre-treated with OR and DS, respectively. Furthermore, DS pre-treated particles revealed enhanced micro-porosities in form of peels and cracks. Significant amounts of gangue minerals (e.g. aluminium and silicon) reported to the tailings, presupposing reduced SR and
发表于 2025-3-22 22:34:24 | 显示全部楼层
Introduction to Thermal Design of Electronic Equipment,s to understand state formation, political reordering and the on-going negotiation of political settlements of various types throughout post-colonial Melanesia. It considers how extractive resource industries c978-981-10-8120-0
发表于 2025-3-23 03:09:55 | 显示全部楼层
发表于 2025-3-23 06:56:25 | 显示全部楼层
Front Matterr nutrient, energy and protein requirements from a landscape composed of two ‘food’ patches that differ in their relative densities of these important nutritional variables. Amongst their findings they conclude that, overall, small species are less able to balance their nutritional requirements when
 关于派博传思  派博传思旗下网站  友情链接
派博传思介绍 公司地理位置 论文服务流程 影响因子官网 SITEMAP 大讲堂 北京大学 Oxford Uni. Harvard Uni.
发展历史沿革 期刊点评 投稿经验总结 SCIENCEGARD IMPACTFACTOR 派博系数 清华大学 Yale Uni. Stanford Uni.
|Archiver|手机版|小黑屋| 派博传思国际 ( 京公网安备110108008328) GMT+8, 2025-5-2 19:16
Copyright © 2001-2015 派博传思   京公网安备110108008328 版权所有 All rights reserved
快速回复 返回顶部 返回列表