SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影响因子:2.373 (IEEE T COMP PACK MAN)

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Submitted on: 11 February 2000. Revised on: 31 March 2000. Accepted on: 22 May 2000. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

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Submitted on: 30 September 2020. Revised on: 19 January 2021. Accepted on: 17 March 2021. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

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Submitted on: 25 June 2018. Revised on: 17 October 2018. Accepted on: 04 December 2018. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

显示全部楼层 · 发表于 2025-3-24 18:47:46

Submitted on: 14 September 2023. Revised on: 20 October 2023. Accepted on: 11 November 2023. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

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Submitted on: 11 April 2009. Revised on: 31 May 2009. Accepted on: 16 June 2009. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

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SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影响因子:2.373 (IEEE T COMP PACK MAN)

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