| 期刊全称 | IEEE Transactions on Components Packaging and Manufacturing Technology | | 期刊简称 | IEEE T COMP PACK MAN | | 影响因子2024 | 2.373 | | 视频video | | | ISSN | 2156-3950 | | eISSN | 2156-3985 | | 出版商 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | | 发行地址 | 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141 | | 学科分类 | 1.Science Citation Index Expanded (SCIE)--Engineering, Manufacturing | Engineering, Electrical & Electronic | Materials Science, Multidisciplinary; 2.Current Contents Electronics & Telecommunications Collection--Signal Processing/Circuits & Systems; 3.Current Contents Engineering, Computing & Technology--Materials Science & Engineering; 4.Essential Science Indicators--Engineering; | | 出版语言 | English |
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发表于 2025-3-21 16:06:30
