Titlebook: Wafer Scale Integration; Earl E. Swartzlander Book 1989 Kluwer Academic Publishers 1989 Programmable Logic.Signal.Software.VLSI.Wafer.comp

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纤细

Wafer-Scale Multichip Packaging Technology,With the many difficulties facing monolithic wafer-scale integration, there has been a significant amount of recent activity focusing on thin-film, multichip packaging approaches utilizing silicon wafers for the substrate. The breadth of these activities can be seen in Table 1, from Hagge [1].

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978-1-4612-8896-1Kluwer Academic Publishers 1989

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KEGEL

https://doi.org/10.1007/978-1-4613-1621-3Programmable Logic; Signal; Software; VLSI; Wafer; computer vision; development; diagnosis; integrated circu

领导权

Promise and Pitfalls of WSI,d then, like the phoenix, a new set of innovators and investors rise from the ashes to make yet another attempt. By itself, this very process is informative. Talented people do not invest their time and money in ill conceived enterprises. They believed the risks could be managed, and that the prize was worth the effort.

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Instinctive

Architectural Yield Optimization,ductor researchers [1]. The expected benefits of smaller size, increased reliability, reduced cost, shorter signal delays, and simpler packaging are significant. Unfortunately, most of the previously reported attempts have been surpassed by increased density, improved circuitry, and better packaging of conventional integrated circuits.