| 书目名称 | Wafer Scale Integration | | 编辑 | Earl E. Swartzlander | | 视频video | | | 图书封面 |  | | 描述 | Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuit | | 出版日期 | Book 1989 | | 关键词 | Programmable Logic; Signal; Software; VLSI; Wafer; computer vision; development; diagnosis; integrated circu | | 版次 | 1 | | doi | https://doi.org/10.1007/978-1-4613-1621-3 | | isbn_softcover | 978-1-4612-8896-1 | | isbn_ebook | 978-1-4613-1621-3 | | copyright | Kluwer Academic Publishers 1989 |
The information of publication is updating
|
|
发表于 2025-3-21 16:41:48
